Manufacturing Description
Module Manufacturer:Hynix
Module Part Number:HMA81GU6MFR8N-UH
DRAM Manufacturer:Hynix
DRAM Components:H5AN8G8NMFR-UHC
DRAM Die Revision / Lithography Resolution:M / 25 nm
Module Manufacturing Date:Week 47, 2017
Module Manufacturing Location:Ichon, Korea
Module Serial Number:4248ECD7h
Manufacturing Identification Label:TS7BN6217N12
Module PCB Revision:00h
Physical & Logical Attributes
Fundamental Memory Class:DDR4 SDRAM
Module Speed Grade:DDR4-2400T downbin
Base Module Type:UDIMM (133,35 mm)
Module Capacity:8192 MB
Reference Raw Card:A1 (8 layers)
Initial Raw Card Designer:SK hynix
Module Nominal Height:31 < H <= 32 mm
Module Thickness Maximum, Front:1 < T <= 2 mm
Module Thickness Maximum, Back:T <= 1 mm
Number of DIMM Ranks:1
Address Mapping from Edge Connector to DRAM:Standard
DRAM Device Package:Standard Monolithic
DRAM Device Package Type: 78-ball FBGA
DRAM Device Die Count:Single die
Signal Loading:Not specified
Number of Column Addresses:10 bits
Number of Row Addresses:16 bits
Number of Bank Addresses:2 bits (4 banks)
Bank Group Addressing:2 bits (4 groups)
DRAM Device Width:8 bits
Programmed DRAM Density:8 Gb
Calculated DRAM Density:8 Gb
Number of DRAM components:8
DRAM Page Size:1 KB
Primary Memory Bus Width:64 bits
Memory Bus Width Extension:0 bits
DRAM Post Package Repair:Supported
Soft Post Package Repair:Not supported
DRAM Timing Parameters
Fine Timebase:0,001 ns
Medium Timebase:0,125 ns
CAS Latencies Supported:10T, 11T, 12T, 13T,
14T, 15T, 16T, 17T,
18T
DRAM Minimum Cycle Time:0,833 ns
DRAM Maximum Cycle Time:1,600 ns
Nominal DRAM Clock Frequency:1200,48 MHz
Minimum DRAM Clock Frequency:625,00 MHz
CAS# Latency Time (tAA min):13,750 ns
RAS# to CAS# Delay Time (tRCD min):13,750 ns
Row Precharge Delay Time (tRP min):13,750 ns
Active to Precharge Delay Time (tRAS min):32,000 ns
Act to Act/Refresh Delay Time (tRC min):45,750 ns
Normal Refresh Recovery Delay Time (tRFC1 min):350,000 ns
2x mode Refresh Recovery Delay Time (tRFC2 min):260,000 ns
4x mode Refresh Recovery Delay Time (tRFC4 min):160,000 ns
Short Row Active to Row Active Delay (tRRD_S min):3,300 ns
Long Row Active to Row Active Delay (tRRD_L min):4,900 ns
Write Recovery Time (tWR min):15,000 ns
Short Write to Read Command Delay (tWTR_S min):2,500 ns
Long Write to Read Command Delay (tWTR_L min):7,500 ns
Long CAS to CAS Delay Time (tCCD_L min):5,000 ns
Four Active Windows Delay (tFAW min):21,000 ns
Maximum Active Window (tMAW):8192*tREFI
Maximum Activate Count (MAC):Unlimited MAC
DRAM VDD 1,20 V operable/endurant:Yes/Yes
Thermal Parameters
Module Thermal Sensor:Not Incorporated
SPD Protocol
SPD Revision:1.1
SPD Bytes Total:512
SPD Bytes Used:384
SPD Checksum (Bytes 00h-7Dh):C39Ah (OK)
SPD Checksum (Bytes 80h-FDh):4A07h (OK)
Part number details
JEDEC DIMM Label:8GB 1Rx8 PC4-2400T-UA1-11
Classification:DDR4 SDRAM
Module Type:288-pin UDIMM
Module Speed:DDR4-2400 17-17-17
Component Density:8Gb
Component Configuration:x8
Memory Depth:1Gb
Data Width & Height:64-bit/LP
Die Generation:1st
Package Type:FBGA SDP (Single Die Package)
Package Material:Lead and Halogen Free
Power Consumption:0°C-85°C / 1.20 VDD Power
FrequencyCASRCDRPRASRCRRDSRRDLWRWTRSWTRLFAW
1200 MHz181717395546183926
1200 MHz171717395546183926
1067 MHz161515354946163823
1067 MHz151515354946163823
933 MHz141313304345143720
933 MHz131313304345143720
800 MHz121111263734122617
800 MHz111111263734122617
667 MHz101010223134102514